Design Guidelines

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Flexible Circuits Guidelines

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Flexible Circuits Guidelines

Flex Circuits Design Guidelines

  Standard Special NPD

Dimensions of single circuit device on a sheet

     

Tolerances of single circuit board dimensions, laser cutting

±0.050 mm

0.025 mm

0.015 mm

Drilled holes (laser drilling, not preferred)

≥0.050 mm

≥0.025 mm

≥0.010 mm

Imaged holes (for liquid polyimide layers only)

≥0.050 mm

≥0.025 mm

≥0.015 mm

Distance edge of hole to substrate edge or cut-out

>0.1 mm

>0.050 mm

>0.025 mm

Distance edge of hole to edge of another hole
(Kapton or LCP) Via

 +0.1 mm

 +0.050 mm

 +0.025 mm

Distance edge of hole to edge of another hole (liquid polyimide) Via

≥via diameter +0.05 mm

 +0.025 mm ≥via diameter

 +0.015 mm

Tolerance hole center-to-center (Kapton or LCP)

≥ ± 0.020 mm

 

 

Tolerance hole center-to-center (Liquid Polyimide)

≥ ± 0.010 mm

   

Metallization annular ring (rim) around a drilled holed top and bottom

≥0.050 mm

on request

not standard

Distance edge of conductor to substrate edge:

≥0.100 mm

 0.050 mm

0.025 mm

Conductor Line & Space aspect ratio to metal thickness:

1 to 1

up 2x

2.5X

Kapton/LCP flex

10 µm

5 µm

 

Liquid polyimide flex

7 µm

5 µm

3 µm

Min. lines and spaces with respect to a maximum aspect ratio of 1 (electroplated)

     

Tolerance conductor of width

0.002 mm
± 0.005 mm     (or 10%)

0.001 mm
± 0.003 mm  (or 5%)

0.00075mm
± 0.003mm 
/0.005 mm

Alignment tolerance metal to machined feature

 0.005 mm
± 0.030 mm

 0.003 mm
± 0.020 mm

0.001 mm

Alignment tolerance front to back

0.010 mm
± 0.060 mm

0.008 mm
± 0.030 mm

0.005 mm

Laser machined features

0.05 mm

0.025 mm

 

Dimensions

≥ 1.000 mm
x 1.000 mm

≥ 0.500 mm
x 0.500 mm

 

Distance edge of feature to substrate or another feature

≥ 0.025 mm

0.020 mm

0.015 mm

Locational tolerance to substrate edge

 ± 0.025 mm

0.020 mm

0.015 mm

Multi-layer

     

Substrate thickness

12.5 microns

On request

On request

Number of layers (metal)

up 7

On request

On request

Number of layers (substrate)

up 6

On request

On request

 

Metallization For Standard Flex Circuits and Microflex Circuits

Purpose

Material

Thickness Range

Adhesion

Ti, TiW, Cr, NiCr

0.02 µm - 0.05 µm sputtered

Diffusion barrier

Pt, Pd, TiW, Ni

50 nm - 200 nm sputtered

Conductor

Au, Ni, Cu, Al

0.1 µm to 1.0 µm sputtered